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今天我們來到台灣南平的技嘉工廠。
我們將告訴您,主機板的整個製造流程與細節
主機板由許多元件構成,這些元件都被裝置在PCB上
PCB指的是印刷電路板
而在元件與電路板的結合之後,就成為電腦裡面的主機板了
PCB送到技嘉工廠的第一道工序是將所有SMD元件焊上板子
SMD指的是表面黏著元件。
SMD 是一種元件安裝的形式,它沒有可以用來穿過PCB以進行焊接的針腳,
但它的邊緣有電氣接點
像音效晶片或者晶片組都是這樣的架構形式.
PCB每個與電氣層接觸部份,都會透過特殊錫膏與元件連結。
錫膏的功用像膠水一樣,協助所有的晶片進入錫爐進行最終焊接。
透過這種方式,所有小元件都可以在焊接前被固定在正確的位置。
正如您可以看到的,焊膏只會附著在元件週邊的PCB空間。
今日的主機板都有很多輕薄短小的小元件直接黏著在板子上,稱之為SMD
這台高速晶片放置器每秒可以放5-10個元件,它真的很快。
這些機器安裝的元件大多只有1毫米寬。
且必須非常精確地放置在PCB上。
今日的主機板,正反兩側都有安設很多元件,
進入產線會先處理背面。
等背面處理好之後,
機器會把主機板翻到另一面
並在SMT 產線再次開始處理工作。
當這些小元件都搞定之後,就該安裝晶片了,
而所有的晶片都是用來驅使主機板運作的,喔,對了,還有CPU的腳座。
在被放上主機板之前,
每個晶片都要先經過不同光波設定的照射驗證,以檢查是否有任何問題
並確認和接點與晶片是否有對齊。
你還可以看到其他晶片,諸如音效、SATA跟USB3.0
都透過這台機器裝設到主機板上,當然CPU腳做的處理方式也一樣
舉例來說,所有比您手指頭大的晶片,都由這台機器來配置。
在這個時候,你主機板上所有的SMD都已經配置完成,等待過錫爐。
錫膏在高溫下溶解,並把元件跟PCB緊密結合。
主機板在高達245°C的錫爐中不同層次移動。
在這個時間點,電氣接點與機械接點完成結合。
現在你的主機板上已經配置有小電阻以及晶片和腳座
該進行視覺檢查了
這個檢查,主要是避免錯位或缺件的情況。
然而這些小元件可能小於2毫米,很難用肉眼睛確檢查,需要AOI的輔助。
自動光學檢測機,可以檢查出是否有任何遺漏或放錯地方的元件。
同時它也可以檢查像音效晶片這一類所有晶片的焊點是否完整。
同時,最後的ICT (Integrated Chip Tester) can verify if every chip that has soldering point below them,
like the chipset, is well connected.
It tests if the chip is well-soldered electrically to the board,
but does not test if the chipset itself is working exactly.
This factory floor is dedicated to additional verification, especially for server components.
Some boards are tested by X-Ray to verify the quality of soldering.
This inspection is a high quality service that allow very high end and server board to be checked in more depth.
And server board to be checked in more depth.
Once these last tests are made after the SMT it's time to go to the DIP (Dual Inline Package)
The DIP stage is the second big important process when making a motherboard.
First you have manual insertion :
all the small components and chipset has been added already,
it's time to place all the other components that have pins going through the PCB.
During this stage all the components are manually inserted.
You can see a long chain of employees inserting the In/Out connectors
Power plugs, PCI-Express and ram slots,
and also the chokes and solid capacitors around the CPU Socket.
Before being finally soldered on the boards
each inserted part need to be in the right place and well positioned,
this is the goal of the inspection before the wave soldering.
The principle of wave soldering is simple,
the motherboard has components on one side, with pins going through the PCB.
The Wave Solder touches the back of the PCB
and these pins with melted solder to attach the components to the board.
After the Wave Soldering process
you usually have residues that are cleaned with a large brush
making the back of your motherboard shinny.
Another inspection is made with some touching up with solder iron if needed.
Then heat-sinks are mounted on the board before another inspection
and check-up by the ICT (Integrated Chip Tester).
Your board is now fully functional
but the biggest quality control still need to be done.
Employees are testing everything from the connectivity to the burn in test of the mainboard.
The Function Box allow easy "Switch ON / Switch Off" of the components
as well as peripherals for testing purposes.
As a part of GIGABYTE Quality testing 100% of the board are tested in the factory.
where basic to advanced functionalities are verified.
Once the board passed all the testing and Quality Analysis
the boards are sent to the next process :
This is the final step for your motherboard
where it makes its way into the box you'll see in the shop.
At the factory the boxes are just flat cardboard
that is quickly fashioned into a retail box by an automatic machine.
Employees stick barcodes and references numbers on the boxes
as well as on the board, then scan the different serial number.
You board is almost ready.
You just need add the accessories, manual, Drivers DVD and close the package.
Each box goes into bigger parcels then weighed and strapped.
This ends our video, now you know how to make Motherboard in a GIGABYTE factory. �